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OpenAI

ASIC Package SI/PI Engineer

San Francisco (Remote)$266k–$445kfulltimemidAdded today

About this role

OpenAI seeks an experienced ASIC Package SI/PI Engineer to drive electrical architecture, modeling, and optimization for advanced AI/HPC silicon packages. You'll own signal and power integrity from feasibility through production, working across high-speed SerDes, memory interfaces, and 2.5D/3D package designs alongside cross-functional teams.

What you'll do

  • Own SI/PI architecture and analysis for advanced AI ASIC packages throughout design lifecycle
  • Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet interfaces
  • Perform package, interposer, and substrate modeling using 2D/3D electromagnetic solvers
  • Define package stack-ups, transmission-line structures, via transitions, and routing guidelines based on SI/PI requirements
  • Perform package-level PDN analysis including impedance, voltage droop, and decoupling optimization
  • Drive die/package co-design optimization and develop automated simulation and design-space exploration flows

What they're looking for

  • Signal integrity and power integrity fundamentals
  • High-speed interconnect and PDN design
  • Electromagnetic simulation tools (Synopsys HSPICE, Ansys EDT, HFSS-PI, SIwave, Cadence Clarity, Sigrity PowerSI)
  • Package layout design (Cadence APD/SIP)
  • Automated design optimization and scripting
  • Advanced packaging (2.5D/3D, silicon interposers, HBM integration)
  • Memory architecture and high-speed interfaces
  • Lab validation using VNA, spectrum analyzers, oscilloscopes, and TDR/TDT
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OpenAI

OpenAI builds AI infrastructure and products, including large-scale data center campuses for AI computing and generative AI applications for enterprise customers. The company is hiring civil engineers, project engineers, electrical design engineers, data center R&D engineers, and AI deployment engineers to expand its infrastructure capabilities and help customers deploy AI solutions.

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Likely interview questions

  • Walk us through your experience with high-speed SerDes channel design—what were the key SI/PI trade-offs you optimized for?
  • Describe your most complex 2.5D or 3D package SI/PI project and how you validated your simulations against measurements.
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