Advanced Packaging Process Engineer

About this role

Tenstorrent is looking for an Advanced Packaging Process Engineer to enhance 2.5D and 3D chiplet packaging technologies, working closely with foundries and OSATs for next-gen AI/ML products. Candidates should have a solid background in advanced packaging processes and materials, along with a strong capability in reliability and failure analysis.

What you'll do

• Oversee advanced package technology for 2.5D/3D chiplet products
• Serve as primary contact for foundries/OSATs to align design rules and manage production challenges
• Collaborate with cross-functional teams on design trade-offs and testing
• Drive yield, manage test vehicles, and coordinate failure analysis
• Implement technology choices and process integration

What they're looking for

• Experience with CoWoS-R/L, FOCoS, EMIB
• Strong reliability and failure analysis skills
• Knowledge of process flows and materials interactions
• Track record with foundries/OSATs on NPI and production ramp
• Effective communication and collaboration abilities
• Advanced degree in relevant fields

Benefits

• Competitive compensation package
• Opportunities for professional growth
• Hybrid work environment
• Collaborative team culture
• Exposure to cutting-edge technology