Array Labs
Printed Circuit Board Design Engineer
About this role
Array Labs seeks a PCB Design Engineer to develop advanced electronic systems for radar satellite constellations. You'll design high-density mixed-signal boards from schematic through qualification, collaborating across RF, digital, and mechanical teams to create the electronics powering next-generation earth observation satellites.
What you'll do
- Design and layout high-density digital and mixed-signal PCBs for radar payloads and on-orbit processing systems
- Develop schematics, select components, and manage full board lifecycle from architecture through manufacturing
- Collaborate with RF, antenna, digital, firmware, and mechanical engineers to validate designs
- Lead prototyping, hardware bring-up, debugging, and qualification testing campaigns
- Iterate on designs based on laboratory, environmental, and on-orbit performance data
- Ensure signal integrity, thermal performance, and manufacturing feasibility for small satellite platforms
What they're looking for
- PCB design and layout tools (Altium, Cadence, or equivalent)
- Schematic capture and component selection
- Mixed-signal electronics and power regulation design
- RF interface design and signal integrity analysis
- Electronics manufacturing, bring-up, and testing procedures
- Thermal and mechanical constraint analysis
- Cross-functional collaboration and communication
- Rapid learning and problem-solving in fast-paced environments
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Array Labs
Array Labs builds advanced radar satellite constellations that provide real-time Earth observation and 3D mapping for disaster response, infrastructure monitoring, and intelligence applications. The company is hiring engineers across hardware design, systems architecture, software development, RF testing, and signal processing to develop and validate next-generation satellite payloads and coordinated fleet operations.
View all jobs at Array LabsLikely interview questions
- Walk us through a complex PCB design you've completed from schematic to manufacturing—what were the key challenges and how did you address signal integrity?
- Describe your experience designing boards with mixed-signal and RF components. How do you manage layout constraints in high-density designs?