Diamond Foundry
R&D Process Engineer, Advanced Bonding Process Development
About this role
Diamond Foundry seeks an R&D Process Engineer to develop advanced bonding techniques for single-crystal diamond wafers used in high-performance computing and power electronics. You'll contribute to scaling innovative diamond manufacturing processes that address thermal challenges in AI, EVs, and 5G/6G applications.
What you'll do
- Design and optimize advanced bonding processes for diamond wafer applications
- Conduct experimental testing and process characterization
- Collaborate with cross-functional teams on process development
- Document technical findings and support process scaling efforts
- Troubleshoot manufacturing challenges and implement solutions
- Contribute to patent development and technical innovation
What they're looking for
- Process engineering and optimization
- Materials science or semiconductor manufacturing knowledge
- Experimental design and data analysis
- Problem-solving and troubleshooting
- Technical documentation and communication
- Project management
- Bonding or thin-film technologies (preferred)
- Familiarity with thermal management challenges
Benefits
- Opportunity to work on cutting-edge sustainable technology
- Fast-growing, profitable unicorn company
- Bay Area location
- Mission-driven work addressing climate and tech challenges
- Access to world-class diamond wafer manufacturing
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Diamond Foundry
Diamond Foundry manufactures single-crystal diamond wafers for high-performance semiconductor applications in AI, power electronics, and 5G/6G systems. The company is hiring laser engineers, software engineers, process engineers, test engineers, and equipment engineers to optimize its advanced diamond manufacturing processes and scale production.
- Website
- diamondfoundry.com
Likely interview questions
- Can you describe your experience developing or optimizing bonding processes, and what metrics did you use to measure success?
- How have you approached troubleshooting thermal or interface challenges in previous manufacturing processes?