Chiplet Physical Design Engineer

About this role

Tenstorrent is seeking a Senior Chiplet Physical Design Engineer to lead the design and integration of chiplets into System-in-Package solutions. This remote position focuses on high-performance CPU and AI silicon in collaboration with diverse international teams.

What you'll do

• Design and integrate multiple chiplets in SiP solutions
• Collaborate with teams across the USA and globally
• Manage synthesis and place-and-route for CPU core designs
• Contribute to performance, power, and area outcomes
• Mentor junior engineers and influence methodologies
• Ensure project execution amidst technical and resource constraints

What they're looking for

• 10+ years in physical design for CPUs or GPUs
• Expertise in Synopsys and/or Cadence tools
• Strong timing closure and ECO flow experience
• Proficient in scripting (TCL required, Python preferred)
• Excellent communication skills
• Experience with advanced nodes (3nm and below)
• Detail-oriented and ownership-driven
• Team player with mentoring capabilities

Benefits

• Competitive salary ranging from $100k - $500k
• Remote work opportunity
• Diverse team environment
• Learning opportunities in chiplet architecture
• Collaborative culture across global teams
• Equitable employment practices