Array Labs
Thermal Engineer
About this role
Array Labs seeks a Board Design Engineer to develop advanced printed circuit assemblies for radar satellite payloads and on-orbit processing systems. You'll design high-density digital and mixed-signal boards under small satellite constraints, collaborating across RF, mechanical, and systems teams to deliver critical Earth observation technology.
What you'll do
- Design and lay out printed circuit assemblies for radar payloads and spacecraft electronics from schematic through manufacturing
- Perform system trades, select components, and manage requirements for digital, mixed-signal, power regulation, and RF interface designs
- Lead prototyping, hardware bring-up, debug, and test campaigns for satellite electronics
- Collaborate with RF, antenna, digital, mechanical, and systems engineers on integrated spacecraft design
- Iterate on designs based on laboratory, environmental, and on-orbit testing feedback
- Ensure signal integrity, processing throughput, and thermal performance within small satellite platform constraints
What they're looking for
- PCB design and layout for high-density digital and mixed-signal boards
- Electronics manufacturing, bring-up, and test procedures
- Schematic capture and component selection
- RF interface and power regulation module design
- Signal integrity and thermal analysis
- Cross-functional collaboration and technical communication
- Rapid prototyping and iteration
- Self-directed learning in aerospace/satellite environments
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Array Labs
Array Labs builds advanced radar satellite constellations that provide real-time Earth observation and 3D mapping for disaster response, infrastructure monitoring, and intelligence applications. The company is hiring engineers across hardware design, systems architecture, software development, RF testing, and signal processing to develop and validate next-generation satellite payloads and coordinated fleet operations.
View all jobs at Array LabsLikely interview questions
- Walk us through a complex board design you've led from schematic to manufacturing—what were the key challenges and how did you address them?
- Describe your experience with high-density digital and mixed-signal PCB layouts; what design rules or constraints were most critical?