Astranis
Thermal Associate Engineer (Summer 2027)
About this role
Join Astranis as a Thermal Associate Engineer for a 12-week summer internship working on satellite thermal design and analysis. You'll collaborate with engineers to develop, test, and verify thermal solutions for components destined for orbit, gaining hands-on experience on projects of equal importance to full-time roles.
What you'll do
- Perform thermal analysis at various fidelity levels on satellite hardware including propulsion, batteries, electronics, RF components, and PCBs
- Design and evaluate thermal solutions such as heaters, heat pipes, thermal interface materials, and coatings
- Support design trades balancing performance, resources, risk, cost, and schedule
- Develop integration and assembly procedures to maintain thermal design intent
- Plan and execute thermal vacuum testing at component and spacecraft levels
- Collaborate with integration and test teams on thermal hardware installation
What they're looking for
- Thermal analysis and modeling
- CAD design software
- ANSYS or Thermal Desktop
- Hardware design and testing
- Mechanical or aerospace engineering
- Problem-solving in fast-paced environments
- Systems integration and verification
- Technical documentation and procedures
Benefits
- Work on flight hardware destined for space
- Mentorship from experienced aerospace engineers
- Potential conversion to full-time employment
- Access to advanced testing facilities
- Meaningful project assignments with real impact
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Astranis
Astranis builds high-throughput satellite communications systems and spacecraft hardware designed to operate reliably in space environments. The company is hiring for technical roles including network planning engineers, radiation effects specialists, PCB layout engineers, and environmental test engineers to support satellite development and customer network architecture.
- Website
- astranis.com
Likely interview questions
- Describe a hardware project you designed, built, and tested from start to finish—what challenges did you face?
- How would you approach thermal analysis for a component with conflicting performance and thermal constraints?