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DoorDash USA

Hardware Engineer - Electronics Packaging & Vehicle Integration

Oakland, CAFrom $205kmidAdded today

About this role

Lead the mechanical design and integration of electronic packaging systems for DoorDash's autonomous delivery vehicles. You'll own electromechanical solutions from concept through production, ensuring reliable, manufacturable hardware that operates in demanding real-world fleet environments.

What you'll do

  • Design and release mechanical packaging, enclosures, housings, and vehicle-level integration solutions aligned with program milestones
  • Create production-quality 3D CAD models and technical drawings; conduct design reviews with cross-functional teams
  • Perform design analysis including tolerance stack-ups, GD&T development, and mechanical validation calculations
  • Develop and execute test plans, proof-of-concept builds, and design validation activities for new assemblies
  • Lead design-for-manufacturability (DFx) initiatives with suppliers to optimize assembly, serviceability, reliability, and cost
  • Support prototype builds, supplier engagement, and continuous improvement through production and fleet deployment

What they're looking for

  • Mechanical design and CAD (3D modeling, technical drawings)
  • Electronics packaging and electromechanical integration
  • Design analysis (tolerance stack-ups, GD&T, finite element analysis)
  • Manufacturing processes (die casting, injection molding, stamping, assembly)
  • Design-for-manufacturability and supplier collaboration
  • Vehicle systems and ruggedized hardware design
  • Technical communication and cross-functional leadership
  • Testing and validation methodologies
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DoorDash USA

DoorDash USA is building autonomous delivery systems including drones and robots, along with internal infrastructure platforms to support large-scale operations. The company is hiring robotics engineers, autonomous systems specialists, infrastructure engineers, and platform software engineers to develop flight control systems, mapping and localization capabilities, and distributed computing platforms.

View all jobs at DoorDash USA

Likely interview questions

  • Walk us through a complex electronics packaging project you led from concept to production—what were the key challenges and tradeoffs?
  • Describe your experience designing enclosures or housings for harsh environments; how did you validate environmental protection requirements?
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