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DoorDash USA

Layout Engineer - Labs

San Francisco, CAFrom $312kmidAdded today

About this role

DoorDash Labs seeks an experienced PCB Layout Engineer to own the physical design of drone delivery aircraft electronics, taking boards from schematic through fabrication and flight-ready assembly. You'll be the sole layout expert on a senior hardware team, designing dense multi-layer boards that integrate power, RF, and high-speed digital while meeting airborne constraints.

What you'll do

  • Own end-to-end PCB layout in Altium Designer including floorplanning, placement, routing, and fabrication release
  • Design dense multi-layer controlled-impedance boards combining power/motor-drive, RF/comms, and high-speed digital
  • Optimize layouts for size, weight, and thermal constraints while maintaining signal and power integrity
  • Develop DFM/DFA/DFT documentation and complete fabrication/assembly packages with stackups and Gerber outputs
  • Apply EMI/EMC-aware layout strategies to meet reliability and regulatory flight requirements
  • Collaborate with electrical, mechanical, power, reliability, and manufacturing teams on board bring-up and debug

What they're looking for

  • Altium Designer (expert level)
  • Signal integrity and power integrity design
  • Controlled-impedance PCB layout
  • Mixed-signal layout (power, RF, high-speed digital)
  • DFM/DFA and IPC standards (IPC-2221/2222, IPC-A-600/610)
  • EMI/EMC layout and grounding strategies
  • Multi-layer board design and stackup
  • Component library management
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DoorDash USA

DoorDash USA is building autonomous delivery systems including drones and robots, along with internal infrastructure platforms to support large-scale operations. The company is hiring robotics engineers, autonomous systems specialists, infrastructure engineers, and platform software engineers to develop flight control systems, mapping and localization capabilities, and distributed computing platforms.

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Likely interview questions

  • Walk us through your approach to handling a dense board with simultaneous power delivery, high-speed digital, and RF requirements—how would you prioritize placement and routing?
  • Describe your experience with signal and power integrity analysis—what tools or methodologies do you use to validate stackup and return path designs?