Lightmatter
Package Layout Engineer
About this role
Lightmatter seeks a Package Layout Design Engineer to create IC package substrate layouts for advanced photonics-based data center systems. You'll work across signal integrity, power integrity, and packaging teams to optimize designs from concept through manufacturing, balancing digital, analog, and photonic domain requirements.
What you'll do
- Design and deliver IC package substrate layouts for standard and advanced packaging technologies
- Develop preliminary substrate designs and floorplans during product concept phase to optimize silicon/package/motherboard stack-up
- Collaborate with substrate suppliers and OSAT companies to implement layout design rules and DFM/DFA closure
- Create fab files and support design for manufacturing and assembly requirements
- Design package layouts meeting signal integrity, power integrity, thermal, and mechanical specifications
- Provide iterative test routes to signal/power integrity engineers and coordinate cross-functional package design tape-outs
What they're looking for
- IC package layout design (3–5 years minimum)
- Allegro X APD proficiency
- Understanding of IC package substrates and organic materials
- Signal integrity and power integrity knowledge
- Design for Manufacturing (DFM) and Design for Assembly (DFA)
- Advanced packaging architectures (2.5D/3D IC, chiplets, interposers)
- Layout tool scripting (SKILL, Python)
- Cross-functional communication and collaboration
Benefits
- Comprehensive health coverage (medical, dental, vision)
- 401(k) retirement matching program
- Paid family leave and generous time off
- Life insurance and disability coverage
- Equity grants for full-time employees
- Flexible hybrid workplace model
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Lightmatter
Lightmatter builds silicon photonics-based optical interconnect products and AI data center infrastructure powered by advanced photonic technologies. The company is hiring hardware validation engineers, mechanical designers, and mixed-signal validation engineers to design test systems, verify high-speed electro-optic links, develop server chassis platforms, and optimize photonic communication circuits.
- Website
- lightmatter.com
Likely interview questions
- Walk us through your experience designing IC package substrates—what were the most complex signal or power integrity challenges you've tackled?
- How have you collaborated with substrate suppliers and OSATs to achieve DFM and DFA closure on a previous project?