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DoorDash USA

PCB Layout Engineer

Oakland, CAFrom $250kmidAdded yesterday

About this role

DoorDash Labs seeks a PCB Layout Engineer to design and own circuit board layouts for autonomous delivery robots, managing floorplanning, stackups, and routing while collaborating with mechanical, thermal, and signal-integrity teams to ensure manufacturability and performance.

What you'll do

  • Perform floorplan analysis and create PCB stackups, layouts, and custom footprints
  • Coordinate with mechanical engineering on fit, form, and assembly compatibility
  • Work with thermal engineering to optimize board thermal performance and heat dissipation
  • Collaborate with SI/PI engineering to ensure signal integrity and power delivery robustness
  • Manage stackup technology selections considering cost, lead-time, and technical trade-offs
  • Drive consistency and quality standards across layout deliverables

What they're looking for

  • PCB layout design (digital and mixed-signal boards)
  • Stackup design and layer stack optimization
  • Controlled-impedance and high-speed routing
  • Power integrity (PI) and power distribution network (PDN) fundamentals
  • Professional layout tools (Altium, Cadence, or equivalent)
  • Cross-functional coordination and communication
  • Manufacturing and design-for-manufacturability (DFM) knowledge
  • Thermal layout and heat management considerations

Benefits

  • 401(k) plan with employer matching
  • 16 weeks of paid parental leave
  • Flexible paid time off and 80 hours of paid sick time annually
  • Medical, dental, vision, disability, and life insurance coverage
  • Equity grant opportunities
  • Wellness and mental health programs
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DoorDash USA

DoorDash USA is building autonomous delivery systems including drones and robots, along with internal infrastructure platforms to support large-scale operations. The company is hiring robotics engineers, autonomous systems specialists, infrastructure engineers, and platform software engineers to develop flight control systems, mapping and localization capabilities, and distributed computing platforms.

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Likely interview questions

  • Walk us through your experience designing stackups for high-speed or mixed-signal boards—what trade-offs did you consider?
  • How do you approach controlled-impedance routing, and what tools or techniques do you use to verify compliance?
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