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Inversion

Avionics Mechanical Engineer I

Playa Vista, California, United States$77k–$116kentryAdded today

About this role

Inversion seeks an Avionics Mechanical Engineer I in Playa Vista to design and test mechanical packaging for avionics systems on advanced reentry spacecraft. You'll create enclosures, brackets, and secondary structures that integrate flight computers, power systems, sensors, and radios while meeting extreme environmental and performance demands for hypersonic reentry.

What you'll do

  • Design avionics enclosures, mounting brackets, trays, panels, and sensor mounts for spacecraft systems
  • Support packaging and installation of flight computers, batteries, radios, navigation sensors, cameras, and wiring harnesses
  • Produce engineering drawings, CAD models, BOMs, assembly instructions, and technical documentation
  • Perform mechanical analysis for mass, stiffness, thermal performance, vibration, and shock loads
  • Execute environmental testing and collaborate with electrical, production, and vehicle-integration teams
  • Optimize designs for manufacturability, serviceability, and vehicle interfaces

What they're looking for

  • CAD design and 3D modeling (CATIA, Solidworks, or equivalent)
  • Mechanical engineering analysis (FEA, thermal, structural)
  • Technical drawing and documentation standards
  • Avionics or aerospace systems knowledge
  • Electromechanical packaging and integration
  • Manufacturing processes and design for manufacturability
  • Environmental testing protocols (vibration, thermal, shock)
  • Problem-solving in high-performance spacecraft applications
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Inversion

Inversion develops advanced hypersonic reentry spacecraft and systems designed to deliver payloads globally in under an hour. The company is hiring Test Engineers, Simulation Engineers, and RF/Propulsion Systems Engineers to design and execute ground testing, flight testing, and simulation validation for their next-generation reentry vehicles.

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Likely interview questions

  • Walk us through your experience designing mechanical enclosures or secondary structures for electronics or avionics systems.
  • Describe a time you optimized a design for both thermal performance and structural stiffness—what trade-offs did you make?
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