Lightmatter
Silicon Packaging Engineer - Intern & New Grad
About this role
Lightmatter is hiring Silicon Packaging Engineers for internship and new grad roles to develop co-packaged optics for next-generation AI data center infrastructure. You'll work across signal integrity, thermal engineering, mechanical design, and packaging integration on the company's photonics engine, Passage™, alongside experienced engineers who've shipped cutting-edge semiconductor products.
What you'll do
- Perform high-speed signal and power integrity analysis including PCIe, UCIe, and SerDes interface design
- Conduct thermal engineering work including CFD simulation, heat sink evaluation, and liquid cooling analysis
- Execute mechanical and thermo-mechanical design tasks including FEA, tolerance stack-up, and solder fatigue assessment
- Support 2.5D/3D packaging integration, fiber attachment, and heterogeneous integration efforts
- Contribute to assembly yield optimization and package reliability validation
- Collaborate with cross-functional teams on photonics packaging challenges
What they're looking for
- Signal and power integrity analysis (PCIe, UCIe, SerDes)
- Thermal simulation and CFD
- Mechanical design and FEA (ANSYS, SolidWorks)
- High-speed interface design and measurement (eye diagrams, jitter, S-parameters)
- Python or MATLAB programming
- GD&T and tolerance stack-up analysis
- 3D packaging and heterogeneous integration concepts
- Electrical or mechanical CAD tools
Benefits
- Comprehensive health insurance (medical, dental, vision)
- Retirement savings matching program
- Generous paid time off and paid family leave
- Life insurance and disability coverage
- Training and professional development
- Flexible hybrid workplace model
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Lightmatter
Lightmatter builds silicon photonics-based optical interconnect products and AI data center infrastructure powered by advanced photonic technologies. The company is hiring hardware validation engineers, mechanical designers, and mixed-signal validation engineers to design test systems, verify high-speed electro-optic links, develop server chassis platforms, and optimize photonic communication circuits.
- Website
- lightmatter.com
Likely interview questions
- Walk us through a project where you performed signal integrity or thermal analysis—what tools did you use and what was the outcome?
- Describe your experience with mechanical FEA or structural analysis; how did you validate your results?