IC Package FEA Engineer

About this role

Lumilens seeks an experienced IC Package Mechanical FEA Engineer to design and optimize advanced semiconductor packaging solutions for high-performance photonic systems serving AI and HPC markets. You'll leverage deep FEA expertise to simulate complex multi-chip architectures, manage thermo-mechanical reliability, and collaborate across R&D, manufacturing, and reliability teams to influence designs from concept through production.

What you'll do

• Perform FEA simulations to evaluate stress, warpage, delamination, and thermal reliability across flip-chip, 3DIC, and chiplet-based package architectures
• Define simulation requirements, analyze results, and deliver design and process recommendations
• Lead DOE studies and sensitivity analyses to identify key reliability and performance drivers
• Support technology roadmapping by assessing new materials and process flows from a thermo-mechanical perspective
• Collaborate with design, photonics, manufacturing, and reliability teams to ensure scalable package designs
• Calibrate models with empirical data and conduct lab experiments to validate simulations

What they're looking for

• FEA tools (Ansys Classic/Mechanical, Abaqus)
• Advanced semiconductor packaging technologies (flip-chip, FOWLP, 2.5D/3D, TSVs, chiplets)
• Materials science and thermo-mechanical behavior (polymers, metals, ceramics)
• Semiconductor packaging processes (die attach, underfill, molding, bumping, reflow)
• Mechanical testing and metrology
• DOE and sensitivity analysis
• Cross-functional collaboration and technical communication
• First-principles mechanical engineering analysis and problem-solving