Advanced Packaging Reliability Engineer

About this role

OpenAI's Hardware organization seeks an Advanced Packaging Reliability Engineer to lead thermal and mechanical reliability assessments for high-performance AI computing packages. You'll optimize package design through modeling, develop qualification strategies, and collaborate across silicon, system, and manufacturing teams to ensure robustness from architecture through production.

What you'll do

• Lead reliability test plans and failure-mechanism analysis for advanced HPC packages, from risk identification through corrective-action implementation
• Drive package design optimization using thermo-mechanical modeling to improve reliability, thermal performance, and mechanical robustness
• Develop and validate package reliability models and lifetime-prediction methodologies for assembly and operating conditions
• Evaluate and recommend package architectures, materials, and assembly processes to maximize reliability and manufacturing robustness
• Predict electromigration lifetime of interconnects under product-specific current, temperature, and workload conditions
• Influence product architecture decisions through simulation-driven insights across chip, package, cooling, and system levels

What they're looking for

• Semiconductor package reliability and failure mechanisms (electromigration, solder fatigue, delamination, warpage)
• Advanced packaging architectures (2.5D/3.5D integration, interposers, chiplets, HBM integration)
• Thermal and mechanical finite-element modeling (FEM)
• Package material science and thermo-mechanical properties
• Failure investigation and root-cause analysis
• Electromigration and interconnect lifetime modeling
• Package qualification methods and reliability acceleration models
• Failure analysis techniques (X-ray imaging, acoustic microscopy, cross-sectioning)